available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 544-2414 +44 2392-232392 model jp503 rev. d hybrid couplers 3 db, 90 description the jp503 pico xinger is a low profile, miniature 3 db hybrid coupler in an easy to use surface mount package designed for w-cd ma and other 3g applications. the jp503 is designed for balanced a mplifiers, variable phase shifters and attenuators, lnas, signal distri bution and is an ideal solution for the ever-increasing demands of the wir eless industry for smaller printed circuit boards and high performance. parts have been subjected to rigorous qualification testing and units are 100% t ested. they are manufactured using materials with x and y thermal e xpansion coefficients compatible with common substrates. available in bot h 5 of 6 tin lead (jp503) and 6 of 6 rohs compliant tin immersion (jp 503s). electrical specifications** frequency isolation insertion loss vswr ghz db min db max max:1 2.0 C 2.3 20 0.30 1.20 1.9 - 2.4 20 0.30 1.25 amplitude balance phase balance power ? jc operating temp. db max degrees ave. cw watts oc/watt oc 0.25 3 25 27.5 -55 to +85 features: ? 2.0 C 2.3 ghz. ? 3g frequencies ? low loss ? high isolation ? 90 o quadrature ? surface mountable ? tape and reel ? available in lead-free (as illustrated) or tin-lead 0.25 3 25 27.5 -55 to +85 **specification based on performance of unit proper ly installed on microstrip printed circuit boards with 50 nominal impedance. specifications subject to chang e without notice. mechanical outline jp503* mechanical outline dimensions are in inches [millimeters] .053 .011 [1.34 0.27 ] pin 1 pin 4 pin 3 pin 2 .250 .010 [6.35 0.25 ] .200 .010 [5.08 0.25 ] pin 1 pin 2 pin 4 pin 3 gnd denotes array number 4x .040 .004 sq [1.01 0.10 ] 4x .020 .004 [0.51 0.10 ] .120 .004 [3.05 0.10 ] .170 .004 [4.32 0.10 ] gnd
usa/canada: toll free: europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 available on tape and reel for pick and place manufacturing. model jp503 rev. d typical performance: 1.9 ghz to 2.4 ghz amplitude balance 3db hybrids are a type of backward wave coupler. i n the design of these couplers, the even mode impedance w as chosen to critically couple or slightly over cou ple at mid band to maximize performance and bandwidth. the amplitude balance specification is defined as the difference (in db) of the signals at the coupled po rt output and the dc port output, when compared to the average output level. phase balance in theory, output ports of a backward wave hybrid c oupler remain in perfect phase quadrature independent of frequency. in practice, factors associated with th e manufacturing processes slightly degrade performanc e. the specification is typical two to three degrees m aximum although in practice, phase balance is statisticall y better than specified (<1 o ). vswr & isolation similar to phase balance, the vswr and isolation of a coupler are theoretically perfect; where the input and output ports are perfectly matched and no power is coupled to the isolated port. in practice, factors associated with the design and manufacturing processes limit vswr and isolation. the significan t limitations are associated with limitations of buil ding perfect 50 transitions at the input and output ports of the device. insertion loss coupler insertion loss is defined as the difference of the input power from the sum of the output power. in practice, loss is typically 0.20 db. specification limits are somewhat higher due to imperfect test condition s; as the couplers must be tested in fixtures which negatively affect results. coupling jp503s -3.8 -3.5 -3.2 -2.9 -2.6 1900 2000 2100 2200 2300 2400 frequency (mhz) coupling (db) return loss jp503s -50 -40 -30 -20 -10 0 1900 2000 2100 2200 2300 2400 frequency (mhz) return loss (db) isolation jp503s -50 -40 -30 -20 -10 1900 2000 2100 2200 2300 2400 frequency (mhz) isolation (db) phase balance jp503s -93 -92 -91 -90 -89 -88 -87 1900 2000 2100 2200 2300 2400 frequency (mhz) phase balance (degrees)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 544-2414 +44 2392-232392 model jp503 rev. d power derating curve power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mo unting surface temperature (base plate temperature), maxim um continuous operating temperature of the coupler, and the thermal insertion loss. the thermal insertion loss is defined in the power handling section of the da ta sheet. as the mounting interface temperature approaches th e maximum continuous operating temperature, the pow er handling decreases to zero.
usa/canada: toll free: europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 available on tape and reel for pick and place manufacturing. model jp503 rev. d pin configuration all of the standard surface mount 3db hybrid couple rs have pin orientations that are symmetrical. when a port is designated as the input, automatically the two o utput and isolated ports are defined. for example, if th e input port for a device was selected to be pin 1, pin 2 i s automatically the isolated port, pin 4 is the 0 deg ree reference output port, and pin 3 is the output port which lags behind the reference output port by 90 degre es. similarly, if pin 3 was to be selected as the input port, the adjacent port on the long side (pin 4) is the i solated port, the adjacent port on the short side (pin 2) i s the 0 degree output port, and the opposite port (pin 1) i s the - 90 degree output port. below is a table of all pos sible orientations. mounting in order for xinger surface mount couplers to work optimally, there must be 50 transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane under the part to ensure pro per electrical performance. if either of these two con ditions are not satisfied, insertion loss, coupling, vswr a nd isolation may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom gro und layers of the pcb. this minimizes ground inductanc e and improves ground continuity. all of the xinger h ybrid and directional couplers are constructed from ceram ic filled ptfe composites that possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17 ppm/ o c when a surface mount hybrid coupler is mounted to a printed circuit board, the primary concerns are; insuring the rf pads of the device are in contact w ith the circuit trace of the pcb and insuring the groun d plane of neither the component nor the pcb is in contact with the rf signal. as long as the geometr y of the unit fits onto the layout of the circuit tra ce on the pcb, and the conditions of the previous paragraph are followed, the couplers performance i s ensured. an example of how the pcb footprint could look is shown below. in specific designs, the 50 lines need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pic k and place equipment tolerances. suggested footprint jp503* mounting footprint dimensions are in inches [millimeters] .174 [4.42] .124 [3.15] 4x 50 transmission line to ensure proper electrical and thermal performance there must be a ground plane with 100% solder conection underneath the part 4x .045 sq [1.14] 4x .024 [0.61] 4x .099 [2.51] 4x .024 [0.61] multiple plated thru holes to ground
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 544-2414 +44 2392-232392 model jp503 rev. d packaging packaging follows eia-481-2. parts are oriented in tape as shown below. minimum order quantities are 2000 per reel and 77 per tube. xinger ? tape & reel diagram
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